485总线隔离收发模块
TTL/CMOS电平和485差分信号相互转换的隔离收发模块。
——可实现信号隔离、信号转换、延长通信距离、增加通信节点、485总线防护等功能。
-
系列标题
-
集成电源
-
通道数
-
传输速率(bps)
-
输入电压(VDC)
-
节点数
-
隔离电压
-
封装形式
-
特性说明
-
资料下载 (3D/PCB封装库/原理图库)
-
认证/标准
技术
手册样品
申请
TDA51S485HC | √ | 1 | 500k | 3.3 | 256 | 5000VDC | SOIC | 高隔离 | - | - | - | - |
TDA51S485HC | √ | 1 | 500k | 3.3 | 256 | 5000VDC | SOIC | 高隔离 | - | |||
TD041S485H | - | 1 | 1M | 3.3,5 | 256 | 3750VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD041S485H | - | 1 | 1M | 5,3.3 | 256 | 3750VAC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD(H)541S485H-A | √ | 1 | 500k | 5 | 256 | 3750VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD541S485H-A | √ | 1 | 500K | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | ||||
TD(H)541S485S-F | √ | - | 20M | 5 | 256 | 5000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD541S485S-F | √ | - | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD(H)541S485S-F1 | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD541S485S-F1 | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD(H)541S485S-FT | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD541S485S-FT | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD041S485H-A | √ | 1 | 500k | 3.3,5 | 256 | 3750VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD041S485H-A | √ | 1 | 500K | 5 | 256 | 3750VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD041S485S-F1 | √ | 2 | 20M | 3.3,5 | 256 | 3750VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD041S485S-F1 | √ | 2 | 20M | 5 | 256 | 3750VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD301D485H-AB | √ | 1 | 11.52k | 3.3 | 128 | 2500VDC | DIP | 高隔离 | - | - | - | - |
TD301D485H-AB | √ | 1 | 11.52K | 3.3 | 128 | 2500VDC | DIP | 高隔离 | - | |||
TD341S485S-F | √ | - | 20M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD341S485S-F | √ | - | 20M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD341S485S-F1 | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD341S485S-F1 | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD341S485S-FT | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD341S485S-FT | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD5(3)01M485 | √ | 1 | 500K | 3.3,5 | 64 | 2500VDC | DIP | 超小体积,自动收发 | - | - | - | - |
TD301M485 | √ | 1 | 500K | 3.3 | 64 | 2500VDC | DIP | 超小体积,自动收发 | ||||
TD501M485 | √ | 1 | 500K | 5 | 64 | 2500VDC | DIP | 超小体积,自动收发 | ||||
TD5(3)21D485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | DIP | 开板式低速 | - | - | - | - |
TD321D485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | DIP | 开板式低速 | ||||
TD521D485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | DIP | 开板式低速 | ||||
TD5(3)21D485-L | √ | 1 | 19.2K | 3.3,5 | 16 | 3000VDC | DIP | 超低功耗 | - | - | - | - |
TD321D485-L | √ | 1 | 19.2K | 3.3 | 16 | 3000VDC | DIP | 超低功耗 | ||||
TD521D485-L | √ | 1 | 19.2K | 5 | 16 | 3000VDC | DIP | 超低功耗 | ||||
TD5(3)21D485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | DIP | 开板式高速 | - | - | - | - |
TD321D485H | √ | 1 | 200K | 3.3 | 64 | 3000VDC | DIP | 开板式高速 | ||||
TD521D485H | √ | 1 | 200K | 5 | 64 | 5000VDC | DIP | 开板式高速 | ||||
TD5(3)21D485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | DIP | 自动收发,开板式 | - | - | - | - |
TD321D485H-A | √ | 1 | 500K | 3.3 | 128 | 3000VDC | DIP | 自动收发,开板式 | ||||
TD521D485H-A | √ | 1 | 500K | 5 | 128 | 3000VDC | DIP | 自动收发,开板式 | ||||
TD5(3)21D485H-E | √ | 1 | 500K | 3.3,5 | 256 | 3000VDC | DIP | 增强版,总线兼容性好 | - | - | - | - |
TD321D485H-E | √ | 1 | 500K | 3.3 | 256 | 3000VDC | DIP | 增强版,总线兼容性好 | ||||
TD521D485H-E | √ | 1 | 500K | 5 | 256 | 3000VDC | DIP | 增强版,总线兼容性好 | ||||
TD5(3)21S485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | SMD | 开板贴片式,低速 | - | - | - | - |
TD321S485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | SMD | 开板贴片式,低速 | ||||
TD521S485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | SMD | 开板贴片式,低速 | ||||
TD5(3)21S485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | SMD | 开板贴片式 | - | - | - | - |
TD321S485H | √ | 1 | 200K | 3.3 | 64 | 3000VDC | SMD | 开板贴片式 | ||||
TD521S485H | √ | 1 | 200K | 5 | 64 | 3000VDC | SMD | 开板贴片式 | ||||
TD5(3)21S485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | SMD | 自动收发,开板贴片式 | - | - | - | - |
TD321S485H-A | √ | 1 | 500K | 3.3 | 128 | 3000VDC | SMD | 自动收发,开板贴片式 | ||||
TD521S485H-A | √ | 1 | 500K | 5 | 128 | 3000VDC | SMD | 自动收发,开板贴片式 | ||||
TD5(3)21S485H-E | √ | 1 | 500K | 3.3,5 | 256 | 3000VDC | SMD | 增强版,总线兼容性好 | - | - | - | - |
TD321S485H-E | √ | 1 | 500K | 3.3 | 256 | 3000VDC | SMD | 增强版,总线兼容性好 | ||||
TD521S485H-E | √ | 1 | 500K | 5 | 256 | 3000VDC | SMD | 增强版,总线兼容性好 | ||||
TD5(3)22D485H-A | √ | 2 | 120K | 3.3,5 | 32 | 2500VDC | DIP | 双路自动收发通道隔离 | - | - | - | - |
TD322D485H-A | √ | 2 | 120K | 3.3 | 32 | 2500VDC | DIP | 双路自动收发通道隔离 | ||||
TD522D485H-A | √ | 2 | 120K | 5 | 32 | 2500VDC | DIP | 双路自动收发通道隔离 | ||||
TD5(3)31S485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | SMD | 小体积SMD,低速 | - | - | - | - |
TD331S485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | SMD | 小体积SMD,低速 | ||||
TD531S485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | SMD | 小体积SMD,低速 | ||||
TD5(3)31S485-L | √ | 1 | 19.2K | 3.3,5 | 16 | 2500VDC | SMD | 超低功耗 | - | - | - | - |
TD331S485-L | √ | 1 | 19.2K | 3.3 | 16 | 2500VDC | SMD | 超低功耗 | ||||
TD531S485-L | √ | 1 | 19.2K | 5 | 16 | 2500VDC | SMD | 超低功耗 | ||||
TD5(3)31S485H | √ | 1 | 150K | 3.3,5 | 128 | 2500VDC | SMD | 小体积SMD封装 | - | - | - | - |
TD331S485H | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 小体积SMD封装 | ||||
TD531S485H | √ | 1 | 150K | 5 | 128 | 2500VDC | SMD | 小体积SMD封装 | ||||
TD5(3)31S485H-A | √ | 1 | 150K | 3.3,5 | 128 | 2500VDC | SMD | 自动收发 | - | - | - | - |
TD331S485H-A | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 自动收发 | ||||
TD531S485H-A | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 自动收发 | ||||
TD5(3)31S485H-E | √ | 1 | 500K | 3.3,5 | 256 | 2500VDC | SMD | SMD增强版,总线兼容性好 | - | - | - | - |
TD331S485H-E | √ | 1 | 500K | 3.3 | 256 | 2500VDC | SMD | SMD增强版,总线兼容性好 | ||||
TD531S485H-E | √ | 1 | 500K | 5 | 256 | 2500VDC | SMD | SMD增强版,总线兼容性好 | ||||
TD541S485H | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD541S485H | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TD541S485H-S | √ | - | 10M | 3.3,5 | 256 | 5000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | - | - | - |
TD541S485H-S | √ | - | 10M | 3.3,5 | 256 | 5000VDC | DFN | 超小,超薄,芯片级 DFN 封装 | - | |||
TDH5(3)01D485H | √ | 1 | 115.2K | 3.3,5 | 32 | 3750VAC | DIP | 高隔离 | - | - | - | - |
TDH301D485H | √ | 1 | 115.2K | 3.3 | 32 | 3750VAC | DIP | 高隔离 | ||||
TDH501D485H | √ | 1 | 115.2K | 5 | 32 | 3750VAC | DIP | 高隔离 | ||||
TDHx01D485H-E | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC | DIP | 单路高速高隔离 | - | - | - | - |
TDH301D485H-E | √ | 1 | 1M | 3.3 | 256 | 5000VDC | DIP | 单路高速高隔离 | ||||
TDH501D485H-E | √ | 1 | 1M | 5 | 256 | 5000VDC | DIP | 单路高速高隔离 | ||||
TDHx01D485H2 | √ | 1 | 1M | 3.3,5 | 128 | 5000VDC | DIP | 单路高速高隔离 | - | - | - | - |
TDH301D485H2 | √ | 1 | 1M | 3.3 | 128 | 5000VDC | DIP | 单路高速高隔离 | ||||
TDH501D485H2 | √ | 1 | 1M | 5 | 128 | 5000VDC | DIP | 单路高速高隔离 | ||||
TDx01D485H | √ | 1 | 200K | 3.3,5 | 32 | 2500VDC | DIP | 高速通用型 | - | - | - | - |
TD301D485H | √ | 1 | 200K | 3.3 | 32 | 2500VDC | DIP | 高速通用型 | ||||
TD501D485H | √ | 1 | 200K | 5 | 32 | 2500VDC | DIP | 高速通用型 | ||||
TDx12P485 | √ | 2 | 9.6K | 3.3,5 | 32 | 2500VDC | DIP | 双通道低速 | - | - | - | - |
TD312P485 | √ | 2 | 9.6K | 3.3 | 32 | 2500VDC | DIP | 双通道低速 | - | |||
TD512P485 | √ | 2 | 9.6K | 5 | 32 | 2500VDC | DIP | 双通道低速 | - | |||
TDx12P485H | √ | 2 | 200K | 3.3,5 | 32 | 2500VDC | DIP | 双通道 | - | - | - | - |
TD312P485H | √ | 1 | 200K | 3.3 | 32 | 2500VDC | DIP | 双通道 | - | |||
TD512P485H | √ | 1 | 200K | 5 | 32 | 2500VDC | DIP | 双通道 | - | |||
TDx1IP485H | √ | 2 | 115.2K | 3.3,5 | 32 | 2500VDC | DIP | 双通道相互隔离 | - | - | - | - |
TD31IP485H | √ | 2 | 115.2K | 3.3 | 32 | 2500VDC | DIP | 双通道相互隔离 | - | |||
TD51IP485H | √ | 2 | 115.2K | 5 | 32 | 2500VDC | DIP | 双通道相互隔离 | - | |||
TLAxx-03K485 | √ | 2 | 500k | 100-430 | 128 | 4000VAC | DIP | 开板式低速 | - | - | - | - |
TLA05-03K485 | √ | 2 | 500k | 100-430 | 128 | 4000VAC | DIP | 开板式低速 | ||||
TD5(3)B1D485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | DIP | 开板式高速 | - | - | - | - |
TD3B1D485H | √ | 1 | 200k | 3.3 | 64 | 3000VDC | DIP | 高速通用型 | ||||
TD5(3)B1D485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | DIP | 自动收发,开板式 | - | - | - | - |
TD3B1D485H-A | √ | 1 | 500k | 3.3 | 128 | 3000VDC | DIP | 高速通用型 | - | |||
TDx01D485 | √ | 1 | 9.6K | 3.3,5 | 32 | 2500VDC | DIP | 高隔离 | - | - | - | - |
TD301D485 | √ | 1 | 9.6K | 3.3 | 32 | 2500VDC | DIP | 高隔离 | - | |||
TD501D485 | √ | 1 | 9.6K | 5 | 32 | 3000VDC | DIP | 增强版,总线兼容性好 | - | |||
TDx01D485H-A | √ | 1 | 115.2k | 3.3,5 | 32 | 2500VDC | DIP | 自动收发 | - | - | - | - |
TD501D485H-A | √ | 1 | 115.2k | 5 | 32 | 2500VDC | DIP | 自动收发 | ||||
TD301D485H-A | √ | 1 | 115.2k | 3.3 | 32 | 2500VDC | DIP | 自动收发 | ||||
TDx01D485H-E | √ | 1 | 500k | 3.3,5 | 256 | 3000VDC | DIP | 增强版,总线兼容性好 | - | - | - | - |
TD301D485H-E | √ | 1 | 500k | 3.3 | 256 | 3000VDC | DIP | 增强版,总线兼容性好 | ||||
TD501D485H-E | √ | 1 | 500k | 5 | 256 | 3000VDC | DIP | 增强版,总线兼容性好 | ||||
TDx11D485H | √ | 1 | 200k | 3.3,5 | 32 | 3000VDC | DIP | 高隔离 | - | - | - | - |
TD311D485H | √ | 1 | 200k | 3.3 | 32 | 3000VDC | DIP | 高隔离 | - | |||
TD511D485H | √ | 1 | 200k | 5 | 32 | 3000VDC | DIP | 高隔离 | - |
* 上方产品参数仅供参考,详细技术参数请以技术规格书为准
-
系列标题